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Copper-Lead Alloy Sputtering Target

Linear Formula:

Cu-Pb

MDL Number:

N/A

EC No.:

N/A

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ORDER

PRODUCT	Product Code	ORDER	SAFETY DATA	TECHNICAL DATA
(2N) 99% Copper-Lead Alloy Sputtering Target	CU-PB-02-ST	Pricing >	SDS >	Data Sheet >
(3N) 99.9% Copper-Lead Alloy Sputtering Target	CU-PB-03-ST	Pricing >	SDS >	Data Sheet >
(4N) 99.99% Copper-Lead Alloy Sputtering Target	CU-PB-04-ST	Pricing >	SDS >	Data Sheet >
(5N) 99.999% Copper-Lead Alloy Sputtering Target	CU-PB-05-ST	Pricing >	SDS >	Data Sheet >

Question? Ask an American Elements Materials Science Engineer

Copper-Lead Alloy Sputtering Target Properties (Theoretical)

Compound Formula	CuPb
Appearance	Solid
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Solubility in H2O	N/A

Copper-Lead Alloy Sputtering Target Health & Safety Information

Signal Word	N/A
Hazard Statements	N/A
Hazard Codes	N/A
RTECS Number	N/A
Transport Information	N/A
MSDS / SDS	Request MSDS / SDS

About Copper-Lead Alloy Sputtering Target

American Elements specializes in producing high purity Copper-Lead Alloy Sputtering Targets with the highest possible density

High Purity (99.99%) Copper-Lead Alloy Sputtering Target

and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard sputtering targets for thin film deposition are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Rotary (cylindrical), round, rectangular, square, ring, annular, oval, "dog-bone" and other shaped targets are available in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Please request a quote above for more information on lead time and pricing.

Copper-Lead Alloy Sputtering Target Synonyms

Lead-copper alloy, UNS L51110, PbCu

Chemical Identifiers

Linear Formula	Cu-Pb
MDL Number	N/A
EC No.	N/A
Pubchem CID	N/A

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Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Payment Methods

American Elements accepts checks, wire transfers, ACH, most major credit and debit cards (Visa, MasterCard, AMEX, Discover) and Paypal.

For the convenience of our international customers, American Elements offers the following additional payment methods:

SOFORT bank tranfer payment for Austria, Belgium, Germany and SwitzerlandJCB cards for Japan and WorldwideBoleto Bancario for BraziliDeal payments for the Netherlands, Germany, Austria, Belgium, Italy, Poland, Spain, Switzerland, and the United KingdomGiroPay for GermanyDankort cards for DenmarkElo cards for BrazileNETS for SingaporeCartaSi for ItalyCarte-Bleue cards for FranceChina UnionPayHipercard cards for BrazilTROY cards for TurkeyBC cards for South KoreaRuPay for India

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Lead

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