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Copper Conductor Paste

CAS #:

7440-50-8

Linear Formula:

MDL Number:

MFCD00010965

EC No.:

231-159-6

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ORDER

PRODUCT	Product Code	ORDER	SAFETY DATA	TECHNICAL DATA
(2N) 99% Copper Conductor Paste	CU-M-02-PST	Pricing >	SDS >	Data Sheet >
(3N) 99.9% Copper Conductor Paste	CU-M-03-PST	Pricing >	SDS >	Data Sheet >
(4N) 99.99% Copper Conductor Paste	CU-M-04-PST	Pricing >	SDS >	Data Sheet >
(5N) 99.999% Copper Conductor Paste	CU-M-05-PST	Pricing >	SDS >	Data Sheet >

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Copper Conductor Paste Properties (Theoretical)

Molecular Weight	63.55
Appearance	Reddish Metal
Melting Point	1085 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Solubility in H2O	N/A
Electrical Resistivity	0.39 kJ/kg K
Electronegativity	1.90 Paulings
Heat of Fusion	13.26 kJ ·mol^-1
Heat of Vaporization	300.4 kJ ·mol^-1
Specific Heat	0.39 kJ/kg K
Thermal Conductivity	401 W ·m-1 ·K-1

Copper Conductor Paste Health & Safety Information

Signal Word	Danger
Hazard Statements	H228-H400
Hazard Codes	F
Risk Codes	11
Safety Statements	16
RTECS Number	GL5325000
Transport Information	UN 3089 4.1/PG 2
WGK Germany	3
GHS Pictograms	GHS07 Exclamation Point GHS08 Health Hazard

About Copper Conductor Paste

Copper Conductor Paste can be fired at 900-980 °C in nitrogen and is suitable for use on alumina and aluminum nitride substrates. Copper paste is generally immediately available in most volumes, including bulk orders. American Elements can produce materials to custom specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as numerous other machined shapes, nanomaterials, and in the form of solutions and organometallic compounds. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available, as is additional research, technical and safety (MSDS) data. Please contact us for information on lead time and pricing above.

Copper Conductor Paste Synonyms

Copper nanoparticle paste, nanocopper based paste

Chemical Identifiers

Linear Formula	Cu
MDL Number	MFCD00010965
EC No.	231-159-6
Beilstein/Reaxys No.	N/A
Pubchem CID	23978
SMILES	[Cu]
InchI Identifier	InChI=1S/Cu
InchI Key	RYGMFSIKBFXOCR-UHFFFAOYSA-N

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Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

Copper

29 Cu 63.546000000 Copper

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d¹⁰ 4s¹. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copper has a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper..