Silver Gold Alloy Sputtering Target

Linear Formula:

AgAu

MDL Number:

N/A

EC No.:

N/A

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Silver Gold Alloy Sputtering Target
AU-AG-02-ST
Pricing > SDS > Data Sheet >
(3N) 99.9% Silver Gold Alloy Sputtering Target
AU-AG-03-ST
Pricing > SDS > Data Sheet >
(4N) 99.99% Silver Gold Alloy Sputtering Target
AG-AU-04-ST
Pricing > SDS > Data Sheet >
(5N) 99.999% Silver Gold Alloy Sputtering Target
AG-AU-05-ST
Pricing > SDS > Data Sheet >

Silver Gold Alloy Sputtering Target Properties (Theoretical)

Compound Formula Ag-Au
Molecular Weight 304.83
Appearance Metallic solid
Melting Point N/A
Boiling Point N/A
Density N/A
Solubility in H2O N/A
Exact Mass 303.871666
Monoisotopic Mass 303.871666

Silver Gold Alloy Sputtering Target Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
RTECS Number N/A
Transport Information N/A
MSDS / SDS

About Silver Gold Alloy Sputtering Target

American Elements specializes in producing high purity Silver Gold Alloy Sputtering Targets with the highest possible density High Purity (99.99%) Silver Gold Alloy Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard sputtering targets for thin film deposition are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Rotary (cylindrical), round, rectangular, square, ring, annular, oval, "dog-bone" and other shaped targets are available in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Please request a quote above for more information on lead time and pricing.

Silver Gold Alloy Sputtering Target Synonyms

Electrum; Gold, compd. with silver (1:1), AuAg, Au-Ag, AgAu20, AgAu25, AgAu30, AgAu35, AgAu40, AgAu50, AuAg20, AuAg25, AuAg30, AuAg35, AuAg40, AuAg50

Chemical Identifiers

Linear Formula AgAu
MDL Number N/A
EC No. N/A
Pubchem CID 25195668
IUPAC Name gold; silver
SMILES [Ag].[Au]
InchI Identifier InChI=1S/Ag.Au
InchI Key PQTCMBYFWMFIGM-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Payment Methods

American Elements accepts checks, wire transfers, ACH, most major credit and debit cards (Visa, MasterCard, AMEX, Discover) and Paypal.

For the convenience of our international customers, American Elements offers the following additional payment methods:

SOFORT bank tranfer payment for Austria, Belgium, Germany and SwitzerlandJCB cards for Japan and WorldwideBoleto Bancario for BraziliDeal payments for the Netherlands, Germany, Austria, Belgium, Italy, Poland, Spain, Switzerland, and the United KingdomGiroPay for GermanyDankort cards for DenmarkElo cards for BrazileNETS for SingaporeCartaSi for ItalyCarte-Bleue cards for FranceChina UnionPayHipercard cards for BrazilTROY cards for TurkeyBC cards for South KoreaRuPay for India

Related Elements

Gold

See more Gold products. Gold (atomic symbol: Au, atomic number: 79) is a Block D, Group 11, Period 6 element with an atomic weight of 196.966569. The number of electrons in each of Gold's shells is 2, 8, 18, 32, 18, 1 and its electron configuration is [Xe]4f142 5d10 6s1. Gold Bohr ModelThe gold atom has a radius of 144 pm and a Van der Waals radius of 217 pm. Gold was first discovered by Early Man prior to 6000 B.C. In its elemental form, gold has a metallic yellow appearance. Gold is a soft metal and is usually alloyed to give it more strength.Elemental Gold It is a good conductor of heat and electricity, and is unaffected by air and most reagents. It is one of the least reactive chemical elements. Gold is often found as a free element and with silver as a gold-silver alloy. Less commonly, it is found in minerals as gold compounds, usually with tellurium.

Silver

See more Silver products. Silver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores, among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'.

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